To make multilayer ceramic chip capacitors more compact with larger capacity, we drew on our advanced material technologies, making the particle sizes super fine. By putting our original processing technologies to full use, we have perfected the advanced layering technique which ensures the precise placing of dielectric and electrode layers, as well as the multilayering technology capable of as many as 1000 layers. The thickness of each layer is at a submicron level. By reducing the thickness of each layer and increasing the number of layers, even the ultrasmall chip combines the capacity close to that of tantalum capacitors with excellent reliability.